{"created":"2023-07-25T08:05:54.056456+00:00","id":4485,"links":{},"metadata":{"_buckets":{"deposit":"9227d962-f5fc-48ff-bfa3-ceea8f7fa34a"},"_deposit":{"created_by":18,"id":"4485","owners":[18],"pid":{"revision_id":0,"type":"depid","value":"4485"},"status":"published"},"_oai":{"id":"oai:ir.kagoshima-u.ac.jp:00004485","sets":["35:67"]},"author_link":["86306","86307","4393"],"item_6_biblio_info_5":{"attribute_name":"収録雑誌名","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"1998","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"619","bibliographicPageEnd":"788","bibliographicPageStart":"780","bibliographicVolumeNumber":"64","bibliographic_titles":[{"bibliographic_title":"日本機械学會論文集. A編","bibliographic_titleLang":"ja"},{"bibliographic_title":"Transactions of the Japan Society of Mechanical Engineers. A","bibliographic_titleLang":"en"}]}]},"item_6_date_6":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"1998-03-25","subitem_date_issued_type":"Issued"}]},"item_6_description_4":{"attribute_name":"要約(Abstract)","attribute_value_mlt":[{"subitem_description":"A study is made for interfacial delaminations between dissimilar materials in LSI plastic packages caused by temperature cyclic loading. Combining a thermoelastic finite element method for nonlinear contact problems and linear fracture mechanics approach, stress intensity factors at the tips of growing delaminations are obtained for the packages with Cu alloy or 42 alloy (Fe-42%Ni) leadframe. The tendency of delamination growth are compared for the two configurations of delamination ; one along the interfaces between the top surface of the die pad and die-bonding layer and the other along those between the bottom surface of the die-pad and encapsulant resin. It is concluded that the former case is more likely to occur for the package with Cu alloy leadframe while for packages with 42 alloy leadframe, the latter case is more likely to occur.","subitem_description_language":"en","subitem_description_type":"Other"}]},"item_6_publisher_23":{"attribute_name":"公開者・出版者","attribute_value_mlt":[{"subitem_publisher":"社団法人日本機械学会","subitem_publisher_language":"ja"}]},"item_6_relation_32":{"attribute_name":"関連（relation）","attribute_value_mlt":[{"subitem_relation_type_id":{"subitem_relation_type_id_text":"http://ci.nii.ac.jp/naid/110002374498/","subitem_relation_type_select":"URI"}}]},"item_6_rights_12":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"社団法人日本機械学会","subitem_rights_language":"ja"}]},"item_6_source_id_7":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"03875008","subitem_source_identifier_type":"PISSN"}]},"item_6_source_id_9":{"attribute_name":"NII書誌ID","attribute_value_mlt":[{"subitem_source_identifier":"AN0018742X","subitem_source_identifier_type":"NCID"}]},"item_6_subject_15":{"attribute_name":"NDC","attribute_value_mlt":[{"subitem_subject":"501","subitem_subject_scheme":"NDC"}]},"item_6_text_44":{"attribute_name":"備考","attribute_value_mlt":[{"subitem_text_value":"本文データは学協会の許諾に基づきCiNiiから複製したものである"}]},"item_6_version_type_14":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"齋藤, 武博","creatorNameLang":"ja"},{"creatorName":"Saitoh, Takehiro","creatorNameLang":"en"},{"creatorName":"サイトウ, タケヒロ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"松山, 英人","creatorNameLang":"ja"},{"creatorName":"Matsuyama, Hidehito","creatorNameLang":"en"},{"creatorName":"マツヤマ, ヒデヒト","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"戸谷, 真之","creatorNameLang":"ja"},{"creatorName":"Toya, Masayuki","creatorNameLang":"en"},{"creatorName":"トヤ, マサユキ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{},{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2016-10-27"}],"displaytype":"detail","filename":"AN0018742X_v64_n619_p780-788.pdf","filesize":[{"value":"704.3 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"AN0018742X_v64_n619_p780-788.pdf","objectType":"fulltext","url":"https://ir.kagoshima-u.ac.jp/record/4485/files/AN0018742X_v64_n619_p780-788.pdf"},"version_id":"9cb28b33-8d02-4f58-9192-2ab0ecb61190"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Structural Analysis","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Thermal Stress","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Finite Element Method","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Fracture Mechanics","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Stress Intensity Factor","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Delamination","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Reliability","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"LSI Package","subitem_subject_language":"en","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析","subitem_title_language":"ja"},{"subitem_title":"オンド サイクル フカジ ニオケル LSI パッケージ ノ イシュ ザイリョウ カイメン ハクリ ノ ハッセイ ケイコウ ニ カンスル カイセキ","subitem_title_language":"ja-Kana"},{"subitem_title":"Linear Fracture Mechanics Analysis of Interfacial Delamination in LSI Packages under Temperature Cyclic Loading","subitem_title_language":"en"}]},"item_type_id":"6","owner":"18","path":["67"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2015-04-06"},"publish_date":"2015-04-06","publish_status":"0","recid":"4485","relation_version_is_last":true,"title":["温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析"],"weko_creator_id":"18","weko_shared_id":-1},"updated":"2024-02-07T05:05:03.594220+00:00"}