{"created":"2023-07-25T08:08:13.349781+00:00","id":7539,"links":{},"metadata":{"_buckets":{"deposit":"03bd3155-d65d-41ae-91a4-4488f1da4589"},"_deposit":{"created_by":18,"id":"7539","owners":[18],"pid":{"revision_id":0,"type":"depid","value":"7539"},"status":"published"},"_oai":{"id":"oai:ir.kagoshima-u.ac.jp:00007539","sets":["35:67"]},"author_link":["86409","86410","4393"],"item_6_biblio_info_5":{"attribute_name":"収録雑誌名","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2000-09-01","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"6","bibliographicPageEnd":"508","bibliographicPageStart":"501","bibliographicVolumeNumber":"3","bibliographic_titles":[{"bibliographic_title":"エレクトロニクス実装学会誌","bibliographic_titleLang":"ja"}]}]},"item_6_date_6":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"2000-09-01","subitem_date_issued_type":"Issued"}]},"item_6_description_4":{"attribute_name":"要約(Abstract)","attribute_value_mlt":[{"subitem_description":"温度サイクル負荷を受けるプラスチックパッケージ内の異材界面はく離の発生部位を特定する目的で, 放射性同位体元素Kr^<85>をトレーサとする気密試験を行った。さらに, はく離が成長するにつれ, それがリードフレームのダイパッド上下コーナ部を起点とする封止樹脂クラックの進展にいかなる影響を及ぼすかに関する数値解析を行った。その結果, Cu合金をリードフレーム材料に用いた場合のはく離発生部位はダイパッド上コーナ部であり, 42合金ではダイパッド下コーナ部であることが推測された。また両者の材料共に, はく離が進展するにつれ, ダイパッド下コーナ部を起点とする封止樹脂クラックはより進展しやすくなり, その進展方向はよりパッケージ底面に垂直な方向へ変化することを指摘した。","subitem_description_language":"ja","subitem_description_type":"Other"},{"subitem_description":"An experimental study using Kr^<85> radioactive tracer techniques is made to determine the initial site of the edge-delamination between dissimilar materials occurring in LSI plastic packages with either Cu alloy (Cu-2%Sn) or alloy 42 (Fe-42%Ni) leadframe under temperature cyclic loading. It is found from the Kr^<85> penetration test that the initial edge-delamination is expected to occur at the upper corner of the die pad edge for Cu alloy leadframe packages whereas it occurs at the lower corner of the die pad edge for alloy 42 leadframe packages. Numerical stress analysis on the effect of delamination length on the encapsulant resin cracking in the packages is also carried out. The delamination is assumed to be located along the top surface of the die pad for Cu alloy leadframe packages and along the bottom surface of the die pad for alloy 42 leadframe packages. The results of numerical stress analysis show that, in both Cu alloy and alloy 42 leadframe packages, resin cracking starting from lower corner of the die pad edge becomes more likely to occur and cracking direction changes toward the bottom surface of the packages as the delamination extends.","subitem_description_language":"en","subitem_description_type":"Other"}]},"item_6_publisher_23":{"attribute_name":"公開者・出版者","attribute_value_mlt":[{"subitem_publisher":"社団法人エレクトロニクス実装学会","subitem_publisher_language":"ja"}]},"item_6_relation_32":{"attribute_name":"関連（relation）","attribute_value_mlt":[{"subitem_relation_type_id":{"subitem_relation_type_id_text":"http://ci.nii.ac.jp/naid/110001238226/","subitem_relation_type_select":"URI"}}]},"item_6_rights_12":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"社団法人エレクトロニクス実装学会","subitem_rights_language":"ja"}]},"item_6_source_id_7":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13439677","subitem_source_identifier_type":"PISSN"}]},"item_6_source_id_9":{"attribute_name":"NII書誌ID","attribute_value_mlt":[{"subitem_source_identifier":"AA11231565","subitem_source_identifier_type":"NCID"}]},"item_6_subject_15":{"attribute_name":"NDC","attribute_value_mlt":[{"subitem_subject":"501","subitem_subject_scheme":"NDC"}]},"item_6_text_44":{"attribute_name":"備考","attribute_value_mlt":[{"subitem_text_value":"本文データは学協会の許諾に基づきCiNiiから複製したものである"}]},"item_6_version_type_14":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"齋藤, 武博","creatorNameLang":"ja"},{"creatorName":"Saitoh, Takehiro","creatorNameLang":"en"},{"creatorName":"サイトウ, タケヒロ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"松山, 英人","creatorNameLang":"ja"},{"creatorName":"Matsuyama, Hidehito","creatorNameLang":"en"},{"creatorName":"マツヤマ, ヒデヒト","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"戸谷, 真之","creatorNameLang":"ja"},{"creatorName":"Toya, Masayuki","creatorNameLang":"en"},{"creatorName":"トヤ, マサユキ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{},{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2016-10-28"}],"displaytype":"detail","filename":"AA11231565_v3_n6_p501-508.pdf","filesize":[{"value":"1.0 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"AA11231565_v3_n6_p501-508.pdf","objectType":"fulltext","url":"https://ir.kagoshima-u.ac.jp/record/7539/files/AA11231565_v3_n6_p501-508.pdf"},"version_id":"f3bcd26a-cf5a-4cf7-8745-60fd6f93c06a"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"温度サイクル負荷時における LSI パッケージの封止樹脂クラックに関する解析 : 初期界面はく離の観察とはく離長さの封止樹脂クラック進展への影響評価","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"温度サイクル負荷時における LSI パッケージの封止樹脂クラックに関する解析 : 初期界面はく離の観察とはく離長さの封止樹脂クラック進展への影響評価","subitem_title_language":"ja"},{"subitem_title":"オンド サイクル フカジ ニオケル LSI パッケージ ノ フウシ ジュシ クラック ニ カンスル カイセキ : ショキ カイメン ハクリ ノ カンサツ ト ハクリ ナガサ ノ フウシ ジュシ クラック シンテン エノ エイキョウ ヒョウカ","subitem_title_language":"ja-Kana"},{"subitem_title":"Numerical and Experimental Analysis of Resin Cracking in LSI Packages under Temperature Cyclic Loading : An Observation of Initial Site of the Edge-Delamination and the Effect of Delamination Length","subitem_title_language":"en"}]},"item_type_id":"6","owner":"18","path":["67"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2015-03-16"},"publish_date":"2015-03-16","publish_status":"0","recid":"7539","relation_version_is_last":true,"title":["温度サイクル負荷時における LSI パッケージの封止樹脂クラックに関する解析 : 初期界面はく離の観察とはく離長さの封止樹脂クラック進展への影響評価"],"weko_creator_id":"18","weko_shared_id":-1},"updated":"2024-02-07T05:05:51.649490+00:00"}