{"created":"2023-07-25T08:08:13.755732+00:00","id":7546,"links":{},"metadata":{"_buckets":{"deposit":"3654e33f-1198-40ce-8ee0-c88d60d16baa"},"_deposit":{"created_by":18,"id":"7546","owners":[18],"pid":{"revision_id":0,"type":"depid","value":"7546"},"status":"published"},"_oai":{"id":"oai:ir.kagoshima-u.ac.jp:00007546","sets":["35:67"]},"author_link":["86468","86469","4393"],"item_6_biblio_info_5":{"attribute_name":"収録雑誌名","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"1999","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"632","bibliographicPageEnd":"916","bibliographicPageStart":"909","bibliographicVolumeNumber":"65","bibliographic_titles":[{"bibliographic_title":"日本機械学會論文集. A編","bibliographic_titleLang":"ja"},{"bibliographic_title":"Transactions of the Japan Society of Mechanical Engineers. A","bibliographic_titleLang":"en"}]}]},"item_6_date_6":{"attribute_name":"作成日","attribute_value_mlt":[{"subitem_date_issued_datetime":"1999-04-25","subitem_date_issued_type":"Issued"}]},"item_6_description_4":{"attribute_name":"要約(Abstract)","attribute_value_mlt":[{"subitem_description":"Further fracture mechanics analyses to understand comprehensively the effects of material properties and package geometries on two configurations of delaminations along the interfaces at a) die-bonding layer and b) the bottom surface of the die pad in LSI plastic packages subjected to temperature cyclic loading were performed. Specifically, the effects on these delaminations of such package constituent material properties as 1) coefficients of thermal expansion and 2) Young's moduli of the encapsulant resin and die-bonding material were examined. Package geometry factors such as thickness and width, including chip size were also considered. The analyses were conducted on the basis of three models of delaminated packages, in which large stress intensity factors at the tips of growing delaminations were induced in our previous work. The impact of these parameters on the delaminations were determined and several design guides of Cu alloy and Fe-42% Ni alloy leadframe packages were pointed out.","subitem_description_language":"en","subitem_description_type":"Other"}]},"item_6_publisher_23":{"attribute_name":"公開者・出版者","attribute_value_mlt":[{"subitem_publisher":"社団法人日本機械学会","subitem_publisher_language":"ja"}]},"item_6_relation_32":{"attribute_name":"関連（relation）","attribute_value_mlt":[{"subitem_relation_type_id":{"subitem_relation_type_id_text":"http://ci.nii.ac.jp/naid/110002374965/","subitem_relation_type_select":"URI"}}]},"item_6_rights_12":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"社団法人日本機械学会","subitem_rights_language":"ja"}]},"item_6_source_id_7":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"03875008","subitem_source_identifier_type":"PISSN"}]},"item_6_source_id_9":{"attribute_name":"NII書誌ID","attribute_value_mlt":[{"subitem_source_identifier":"AN0018742X","subitem_source_identifier_type":"NCID"}]},"item_6_subject_15":{"attribute_name":"NDC","attribute_value_mlt":[{"subitem_subject":"501","subitem_subject_scheme":"NDC"}]},"item_6_text_44":{"attribute_name":"備考","attribute_value_mlt":[{"subitem_text_value":"本文データは学協会の許諾に基づきCiNiiから複製したものである"}]},"item_6_version_type_14":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"齋藤, 武博","creatorNameLang":"ja"},{"creatorName":"Saitoh, Takehiro","creatorNameLang":"en"},{"creatorName":"サイトウ, タケヒロ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"松山, 英人","creatorNameLang":"ja"},{"creatorName":"Matsuyama, Hidehito","creatorNameLang":"en"},{"creatorName":"マツヤマ, ヒデヒト","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"戸谷, 真之","creatorNameLang":"ja"},{"creatorName":"Toya, Masayuki","creatorNameLang":"en"},{"creatorName":"トヤ, マサユキ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{},{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2016-10-28"}],"displaytype":"detail","filename":"AN0018742X_v65_n632_p909-916.pdf","filesize":[{"value":"752.8 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"AN0018742X_v65_n632_p909-916.pdf","objectType":"fulltext","url":"https://ir.kagoshima-u.ac.jp/record/7546/files/AN0018742X_v65_n632_p909-916.pdf"},"version_id":"80654860-5ed5-4d50-a997-f4505c737872"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Structural Analysis","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Thermal Stress","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Finite Element Method","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Fracture Mechanics","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Stress Intensity Factor","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Delamination","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Reliability","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"LSI Package","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Leadframe","subitem_subject_language":"en","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析 : 第2報, 構成材料の機械的特性及び設計寸法の影響","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析 : 第2報, 構成材料の機械的特性及び設計寸法の影響","subitem_title_language":"ja"},{"subitem_title":"オンド サイクル フカジ ニオケル LSI パッケージ ノ イシュ ザイリョウ カイメン ハクリ ノ ハッセイ ケイコウ ニ カンスル カイセキ : ダイ2ホウ, コウセイ ザイリョウ ノ キカイテキ トクセイ オヨビ セッケイ スンポウ ノ エイキョウ","subitem_title_language":"ja-Kana"},{"subitem_title":"Linear Fracture Mechanics Analysis of Interfacial Delamination in LSI Packages under Temperature Cyclic Loading : 2nd Report, The Effects of Material Properties and Package Geometry Factors","subitem_title_language":"en"}]},"item_type_id":"6","owner":"18","path":["67"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2015-03-17"},"publish_date":"2015-03-17","publish_status":"0","recid":"7546","relation_version_is_last":true,"title":["温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析 : 第2報, 構成材料の機械的特性及び設計寸法の影響"],"weko_creator_id":"18","weko_shared_id":-1},"updated":"2024-02-07T05:06:09.161343+00:00"}