WEKO3
アイテム
{"_buckets": {"deposit": "9227d962-f5fc-48ff-bfa3-ceea8f7fa34a"}, "_deposit": {"created_by": 3, "id": "4485", "owners": [3], "pid": {"revision_id": 0, "type": "depid", "value": "4485"}, "status": "published"}, "_oai": {"id": "oai:ir.kagoshima-u.ac.jp:00004485", "sets": ["67"]}, "author_link": ["86308", "86313", "86310", "86311", "4393", "86306", "86307", "86309", "86312"], "item_6_alternative_title_18": {"attribute_name": "別言語のタイトル", "attribute_value_mlt": [{"subitem_alternative_title": "Linear Fracture Mechanics Analysis of Interfacial Delamination in LSI Packages under Temperature Cyclic Loading"}]}, "item_6_alternative_title_19": {"attribute_name": "タイトルよみ", "attribute_value_mlt": [{"subitem_alternative_title": "オンド サイクル フカジ ニオケル LSI パッケージ ノ イシュ ザイリョウ カイメン ハクリ ノ ハッセイ ケイコウ ニ カンスル カイセキ"}]}, "item_6_biblio_info_5": {"attribute_name": "収録雑誌名", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "1998", "bibliographicIssueDateType": "Issued"}, "bibliographicIssueNumber": "619", "bibliographicPageEnd": "788", "bibliographicPageStart": "780", "bibliographicVolumeNumber": "64", "bibliographic_titles": [{"bibliographic_title": "日本機械学會論文集. A編"}, {"bibliographic_title": "Transactions of the Japan Society of Mechanical Engineers. A", "bibliographic_titleLang": "en"}]}]}, "item_6_date_6": {"attribute_name": "作成日", "attribute_value_mlt": [{"subitem_date_issued_datetime": "1998-03-25"}]}, "item_6_description_4": {"attribute_name": "要約(Abstract)", "attribute_value_mlt": [{"subitem_description": "A study is made for interfacial delaminations between dissimilar materials in LSI plastic packages caused by temperature cyclic loading. Combining a thermoelastic finite element method for nonlinear contact problems and linear fracture mechanics approach, stress intensity factors at the tips of growing delaminations are obtained for the packages with Cu alloy or 42 alloy (Fe-42%Ni) leadframe. The tendency of delamination growth are compared for the two configurations of delamination ; one along the interfaces between the top surface of the die pad and die-bonding layer and the other along those between the bottom surface of the die-pad and encapsulant resin. It is concluded that the former case is more likely to occur for the package with Cu alloy leadframe while for packages with 42 alloy leadframe, the latter case is more likely to occur.", "subitem_description_type": "Other"}]}, "item_6_full_name_2": {"attribute_name": "著者よみ", "attribute_value_mlt": [{"nameIdentifiers": [{"nameIdentifier": "86308", "nameIdentifierScheme": "WEKO"}], "names": [{"name": "サイトウ, タケヒロ"}]}, {"nameIdentifiers": [{"nameIdentifier": "86309", "nameIdentifierScheme": "WEKO"}], "names": [{"name": "マツヤマ, ヒデヒト"}]}, {"nameIdentifiers": [{"nameIdentifier": "86310", "nameIdentifierScheme": "WEKO"}], "names": [{"name": "トヤ, マサユキ"}]}]}, "item_6_full_name_3": {"attribute_name": "別言語の著者", "attribute_value_mlt": [{"nameIdentifiers": [{"nameIdentifier": "86311", "nameIdentifierScheme": "WEKO"}], "names": [{"name": "SAITOH, Takehiro"}]}, {"nameIdentifiers": [{"nameIdentifier": "86312", "nameIdentifierScheme": "WEKO"}], "names": [{"name": "MATSUYAMA, Hidehito"}]}, {"nameIdentifiers": [{"nameIdentifier": "86313", "nameIdentifierScheme": "WEKO"}], "names": [{"name": "TOYA, Masayuki"}]}]}, "item_6_publisher_23": {"attribute_name": "公開者・出版者", "attribute_value_mlt": [{"subitem_publisher": "社団法人日本機械学会"}]}, "item_6_relation_32": {"attribute_name": "関連(relation)", "attribute_value_mlt": [{"subitem_relation_name": [{"subitem_relation_name_text": "http://ci.nii.ac.jp/naid/110002374498/"}]}]}, "item_6_rights_12": {"attribute_name": "権利", "attribute_value_mlt": [{"subitem_rights": "社団法人日本機械学会"}, {"subitem_rights": "本文データは学協会の許諾に基づきCiNiiから複製したものである"}]}, "item_6_source_id_7": {"attribute_name": "ISSN", "attribute_value_mlt": [{"subitem_source_identifier": "0387-5008", "subitem_source_identifier_type": "ISSN"}]}, "item_6_source_id_9": {"attribute_name": "NII書誌ID", "attribute_value_mlt": [{"subitem_source_identifier": "AN0018742X", "subitem_source_identifier_type": "NCID"}]}, "item_6_subject_15": {"attribute_name": "NDC", "attribute_value_mlt": [{"subitem_subject": "501", "subitem_subject_scheme": "NDC"}]}, "item_6_text_30": {"attribute_name": "NIIタイプ", "attribute_value_mlt": [{"subitem_text_value": "Journal Article"}]}, "item_6_text_45": {"attribute_name": "備考(非公開)", "attribute_value_mlt": [{"subitem_text_value": "CiNiiからの複製(ファイル改変不可)"}]}, "item_6_version_type_14": {"attribute_name": "著者版フラグ", "attribute_value_mlt": [{"subitem_version_resource": "http://purl.org/coar/version/c_970fb48d4fbd8a85", "subitem_version_type": "VoR"}]}, "item_creator": {"attribute_name": "著者", "attribute_type": "creator", "attribute_value_mlt": [{"creatorNames": [{"creatorName": "齋藤, 武博"}], "nameIdentifiers": [{"nameIdentifier": "86306", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "松山, 英人"}], "nameIdentifiers": [{"nameIdentifier": "86307", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "戸谷, 真之"}], "nameIdentifiers": [{"nameIdentifier": "4393", "nameIdentifierScheme": "WEKO"}, {"nameIdentifier": "1000090026279", "nameIdentifierScheme": "NRID", "nameIdentifierURI": " "}]}]}, "item_files": {"attribute_name": "ファイル情報", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2016-10-27"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "AN0018742X_v64_n619_p780-788.pdf", "filesize": [{"value": "704.3 kB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "licensetype": "license_free", "mimetype": "application/pdf", "size": 704300.0, "url": {"label": "AN0018742X_v64_n619_p780-788.pdf", "url": "https://ir.kagoshima-u.ac.jp/record/4485/files/AN0018742X_v64_n619_p780-788.pdf"}, "version_id": "9cb28b33-8d02-4f58-9192-2ab0ecb61190"}]}, "item_keyword": {"attribute_name": "キーワード", "attribute_value_mlt": [{"subitem_subject": "Structural Analysis", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Thermal Stress", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Finite Element Method", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Fracture Mechanics", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Stress Intensity Factor", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Delamination", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Reliability", "subitem_subject_scheme": "Other"}, {"subitem_subject": "LSI Package", "subitem_subject_scheme": "Other"}]}, "item_language": {"attribute_name": "言語", "attribute_value_mlt": [{"subitem_language": "jpn"}]}, "item_resource_type": {"attribute_name": "資源タイプ", "attribute_value_mlt": [{"resourcetype": "journal article", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析", "item_titles": {"attribute_name": "タイトル", "attribute_value_mlt": [{"subitem_title": "温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析"}]}, "item_type_id": "6", "owner": "3", "path": ["67"], "permalink_uri": "http://hdl.handle.net/10232/10535", "pubdate": {"attribute_name": "公開日", "attribute_value": "2015-04-06"}, "publish_date": "2015-04-06", "publish_status": "0", "recid": "4485", "relation": {}, "relation_version_is_last": true, "title": ["温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析"], "weko_shared_id": 3}
温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析
http://hdl.handle.net/10232/10535
http://hdl.handle.net/10232/10535b2108db7-2e52-4a34-85d9-65ed239d4ea5
名前 / ファイル | ライセンス | アクション |
---|---|---|
![]() |
|
Item type | 学術雑誌論文 / Journal Article(1) | |||||
---|---|---|---|---|---|---|
公開日 | 2015-04-06 | |||||
タイトル | ||||||
タイトル | 温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析 | |||||
タイトルよみ | ||||||
タイトルよみ | オンド サイクル フカジ ニオケル LSI パッケージ ノ イシュ ザイリョウ カイメン ハクリ ノ ハッセイ ケイコウ ニ カンスル カイセキ | |||||
別言語のタイトル | ||||||
その他のタイトル | Linear Fracture Mechanics Analysis of Interfacial Delamination in LSI Packages under Temperature Cyclic Loading | |||||
著者 |
齋藤, 武博
× 齋藤, 武博× 松山, 英人× 戸谷, 真之 |
|||||
著者よみ | ||||||
姓名 | サイトウ, タケヒロ | |||||
著者よみ | ||||||
姓名 | マツヤマ, ヒデヒト | |||||
著者よみ | ||||||
姓名 | トヤ, マサユキ | |||||
別言語の著者 | ||||||
姓名 | SAITOH, Takehiro | |||||
別言語の著者 | ||||||
姓名 | MATSUYAMA, Hidehito | |||||
別言語の著者 | ||||||
姓名 | TOYA, Masayuki | |||||
言語 | ||||||
言語 | jpn | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Structural Analysis | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Thermal Stress | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Finite Element Method | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Fracture Mechanics | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Stress Intensity Factor | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Delamination | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Reliability | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | LSI Package | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
要約(Abstract) | ||||||
内容記述タイプ | Other | |||||
内容記述 | A study is made for interfacial delaminations between dissimilar materials in LSI plastic packages caused by temperature cyclic loading. Combining a thermoelastic finite element method for nonlinear contact problems and linear fracture mechanics approach, stress intensity factors at the tips of growing delaminations are obtained for the packages with Cu alloy or 42 alloy (Fe-42%Ni) leadframe. The tendency of delamination growth are compared for the two configurations of delamination ; one along the interfaces between the top surface of the die pad and die-bonding layer and the other along those between the bottom surface of the die-pad and encapsulant resin. It is concluded that the former case is more likely to occur for the package with Cu alloy leadframe while for packages with 42 alloy leadframe, the latter case is more likely to occur. | |||||
収録雑誌名 |
日本機械学會論文集. A編 en : Transactions of the Japan Society of Mechanical Engineers. A 巻 64, 号 619, p. 780-788, 発行日 1998 |
|||||
作成日 | ||||||
日付 | 1998-03-25 | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
ISSN | 0387-5008 | |||||
NII書誌ID(雑誌) | ||||||
収録物識別子タイプ | NCID | |||||
NC ID | AN0018742X | |||||
権利 | ||||||
権利情報 | 社団法人日本機械学会 | |||||
権利 | ||||||
権利情報 | 本文データは学協会の許諾に基づきCiNiiから複製したものである | |||||
出版タイプ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
NDC | ||||||
主題Scheme | NDC | |||||
主題 | 501 | |||||
公開者・出版者 | ||||||
出版者 | 社団法人日本機械学会 | |||||
関連(relation) |