WEKO3
アイテム
{"_buckets": {"deposit": "3654e33f-1198-40ce-8ee0-c88d60d16baa"}, "_deposit": {"created_by": 3, "id": "7546", "owners": [3], "pid": {"revision_id": 0, "type": "depid", "value": "7546"}, "status": "published"}, "_oai": {"id": "oai:ir.kagoshima-u.ac.jp:00007546", "sets": ["67"]}, "author_link": ["86475", "4393", "86473", "86469", "86472", "86468", "86474", "86471", "86470"], "item_6_alternative_title_18": {"attribute_name": "別言語のタイトル", "attribute_value_mlt": [{"subitem_alternative_title": "Linear Fracture Mechanics Analysis of Interfacial Delamination in LSI Packages under Temperature Cyclic Loading : 2nd Report, The Effects of Material Properties and Package Geometry Factors"}]}, "item_6_alternative_title_19": {"attribute_name": "タイトルよみ", "attribute_value_mlt": [{"subitem_alternative_title": "オンド サイクル フカジ ニオケル LSI パッケージ ノ イシュ ザイリョウ カイメン ハクリ ノ ハッセイ ケイコウ ニ カンスル カイセキ : ダイ2ホウ, コウセイ ザイリョウ ノ キカイテキ トクセイ オヨビ セッケイ スンポウ ノ エイキョウ"}]}, "item_6_biblio_info_5": {"attribute_name": "収録雑誌名", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "1999", "bibliographicIssueDateType": "Issued"}, "bibliographicIssueNumber": "632", "bibliographicPageEnd": "916", "bibliographicPageStart": "909", "bibliographicVolumeNumber": "65", "bibliographic_titles": [{"bibliographic_title": "日本機械学會論文集. A編"}, {"bibliographic_title": "Transactions of the Japan Society of Mechanical Engineers. A", "bibliographic_titleLang": "en"}]}]}, "item_6_date_6": {"attribute_name": "作成日", "attribute_value_mlt": [{"subitem_date_issued_datetime": "1999-04-25"}]}, "item_6_description_4": {"attribute_name": "要約(Abstract)", "attribute_value_mlt": [{"subitem_description": "Further fracture mechanics analyses to understand comprehensively the effects of material properties and package geometries on two configurations of delaminations along the interfaces at a) die-bonding layer and b) the bottom surface of the die pad in LSI plastic packages subjected to temperature cyclic loading were performed. Specifically, the effects on these delaminations of such package constituent material properties as 1) coefficients of thermal expansion and 2) Young\u0027s moduli of the encapsulant resin and die-bonding material were examined. Package geometry factors such as thickness and width, including chip size were also considered. The analyses were conducted on the basis of three models of delaminated packages, in which large stress intensity factors at the tips of growing delaminations were induced in our previous work. The impact of these parameters on the delaminations were determined and several design guides of Cu alloy and Fe-42% Ni alloy leadframe packages were pointed out.", "subitem_description_type": "Other"}]}, "item_6_full_name_2": {"attribute_name": "著者よみ", "attribute_value_mlt": [{"nameIdentifiers": [{"nameIdentifier": "86470", "nameIdentifierScheme": "WEKO"}], "names": [{"name": "サイトウ, タケヒロ"}]}, {"nameIdentifiers": [{"nameIdentifier": "86471", "nameIdentifierScheme": "WEKO"}], "names": [{"name": "マツヤマ, ヒデヒト"}]}, {"nameIdentifiers": [{"nameIdentifier": "86472", "nameIdentifierScheme": "WEKO"}], "names": [{"name": "トヤ, マサユキ"}]}]}, "item_6_full_name_3": {"attribute_name": "別言語の著者", "attribute_value_mlt": [{"nameIdentifiers": [{"nameIdentifier": "86473", "nameIdentifierScheme": "WEKO"}], "names": [{"name": "SAITOH, Takehiro"}]}, {"nameIdentifiers": [{"nameIdentifier": "86474", "nameIdentifierScheme": "WEKO"}], "names": [{"name": "MATSUYAMA, Hidehito"}]}, {"nameIdentifiers": [{"nameIdentifier": "86475", "nameIdentifierScheme": "WEKO"}], "names": [{"name": "TOYA, Masayuki"}]}]}, "item_6_publisher_23": {"attribute_name": "公開者・出版者", "attribute_value_mlt": [{"subitem_publisher": "社団法人日本機械学会"}]}, "item_6_relation_32": {"attribute_name": "関連(relation)", "attribute_value_mlt": [{"subitem_relation_name": [{"subitem_relation_name_text": "http://ci.nii.ac.jp/naid/110002374965/"}]}]}, "item_6_rights_12": {"attribute_name": "権利", "attribute_value_mlt": [{"subitem_rights": "社団法人日本機械学会"}, {"subitem_rights": "本文データは学協会の許諾に基づきCiNiiから複製したものである"}]}, "item_6_source_id_7": {"attribute_name": "ISSN", "attribute_value_mlt": [{"subitem_source_identifier": "0387-5008", "subitem_source_identifier_type": "ISSN"}]}, "item_6_source_id_9": {"attribute_name": "NII書誌ID", "attribute_value_mlt": [{"subitem_source_identifier": "AN0018742X", "subitem_source_identifier_type": "NCID"}]}, "item_6_subject_15": {"attribute_name": "NDC", "attribute_value_mlt": [{"subitem_subject": "501", "subitem_subject_scheme": "NDC"}]}, "item_6_text_30": {"attribute_name": "NIIタイプ", "attribute_value_mlt": [{"subitem_text_value": "Journal Article"}]}, "item_6_text_45": {"attribute_name": "備考(非公開)", "attribute_value_mlt": [{"subitem_text_value": "CiNiiからの複製(ファイル改変不可)"}]}, "item_6_version_type_14": {"attribute_name": "著者版フラグ", "attribute_value_mlt": [{"subitem_version_resource": "http://purl.org/coar/version/c_970fb48d4fbd8a85", "subitem_version_type": "VoR"}]}, "item_creator": {"attribute_name": "著者", "attribute_type": "creator", "attribute_value_mlt": [{"creatorNames": [{"creatorName": "齋藤, 武博"}], "nameIdentifiers": [{"nameIdentifier": "86468", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "松山, 英人"}], "nameIdentifiers": [{"nameIdentifier": "86469", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "戸谷, 真之"}], "nameIdentifiers": [{"nameIdentifier": "4393", "nameIdentifierScheme": "WEKO"}, {"nameIdentifier": "1000090026279", "nameIdentifierScheme": "NRID", "nameIdentifierURI": " "}]}]}, "item_files": {"attribute_name": "ファイル情報", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2016-10-28"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "AN0018742X_v65_n632_p909-916.pdf", "filesize": [{"value": "752.8 kB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "licensetype": "license_free", "mimetype": "application/pdf", "size": 752800.0, "url": {"label": "AN0018742X_v65_n632_p909-916.pdf", "url": "https://ir.kagoshima-u.ac.jp/record/7546/files/AN0018742X_v65_n632_p909-916.pdf"}, "version_id": "80654860-5ed5-4d50-a997-f4505c737872"}]}, "item_keyword": {"attribute_name": "キーワード", "attribute_value_mlt": [{"subitem_subject": "Structural Analysis", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Thermal Stress", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Finite Element Method", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Fracture Mechanics", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Stress Intensity Factor", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Delamination", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Reliability", "subitem_subject_scheme": "Other"}, {"subitem_subject": "LSI Package", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Leadframe", "subitem_subject_scheme": "Other"}]}, "item_language": {"attribute_name": "言語", "attribute_value_mlt": [{"subitem_language": "jpn"}]}, "item_resource_type": {"attribute_name": "資源タイプ", "attribute_value_mlt": [{"resourcetype": "journal article", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析 : 第2報, 構成材料の機械的特性及び設計寸法の影響", "item_titles": {"attribute_name": "タイトル", "attribute_value_mlt": [{"subitem_title": "温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析 : 第2報, 構成材料の機械的特性及び設計寸法の影響"}]}, "item_type_id": "6", "owner": "3", "path": ["67"], "permalink_uri": "http://hdl.handle.net/10232/10536", "pubdate": {"attribute_name": "公開日", "attribute_value": "2015-03-17"}, "publish_date": "2015-03-17", "publish_status": "0", "recid": "7546", "relation": {}, "relation_version_is_last": true, "title": ["温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析 : 第2報, 構成材料の機械的特性及び設計寸法の影響"], "weko_shared_id": 3}
温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析 : 第2報, 構成材料の機械的特性及び設計寸法の影響
http://hdl.handle.net/10232/10536
http://hdl.handle.net/10232/1053690985bbd-723e-4b86-a794-aabac9c80e47
名前 / ファイル | ライセンス | アクション |
---|---|---|
![]() |
|
Item type | 学術雑誌論文 / Journal Article(1) | |||||
---|---|---|---|---|---|---|
公開日 | 2015-03-17 | |||||
タイトル | ||||||
タイトル | 温度サイクル負荷時におけるLSIパッケージの異種材料界面はく離の発生傾向に関する解析 : 第2報, 構成材料の機械的特性及び設計寸法の影響 | |||||
タイトルよみ | ||||||
タイトルよみ | オンド サイクル フカジ ニオケル LSI パッケージ ノ イシュ ザイリョウ カイメン ハクリ ノ ハッセイ ケイコウ ニ カンスル カイセキ : ダイ2ホウ, コウセイ ザイリョウ ノ キカイテキ トクセイ オヨビ セッケイ スンポウ ノ エイキョウ | |||||
別言語のタイトル | ||||||
その他のタイトル | Linear Fracture Mechanics Analysis of Interfacial Delamination in LSI Packages under Temperature Cyclic Loading : 2nd Report, The Effects of Material Properties and Package Geometry Factors | |||||
著者 |
齋藤, 武博
× 齋藤, 武博× 松山, 英人× 戸谷, 真之 |
|||||
著者よみ | ||||||
姓名 | サイトウ, タケヒロ | |||||
著者よみ | ||||||
姓名 | マツヤマ, ヒデヒト | |||||
著者よみ | ||||||
姓名 | トヤ, マサユキ | |||||
別言語の著者 | ||||||
姓名 | SAITOH, Takehiro | |||||
別言語の著者 | ||||||
姓名 | MATSUYAMA, Hidehito | |||||
別言語の著者 | ||||||
姓名 | TOYA, Masayuki | |||||
言語 | ||||||
言語 | jpn | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Structural Analysis | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Thermal Stress | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Finite Element Method | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Fracture Mechanics | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Stress Intensity Factor | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Delamination | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Reliability | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | LSI Package | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Leadframe | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
要約(Abstract) | ||||||
内容記述タイプ | Other | |||||
内容記述 | Further fracture mechanics analyses to understand comprehensively the effects of material properties and package geometries on two configurations of delaminations along the interfaces at a) die-bonding layer and b) the bottom surface of the die pad in LSI plastic packages subjected to temperature cyclic loading were performed. Specifically, the effects on these delaminations of such package constituent material properties as 1) coefficients of thermal expansion and 2) Young's moduli of the encapsulant resin and die-bonding material were examined. Package geometry factors such as thickness and width, including chip size were also considered. The analyses were conducted on the basis of three models of delaminated packages, in which large stress intensity factors at the tips of growing delaminations were induced in our previous work. The impact of these parameters on the delaminations were determined and several design guides of Cu alloy and Fe-42% Ni alloy leadframe packages were pointed out. | |||||
収録雑誌名 |
日本機械学會論文集. A編 en : Transactions of the Japan Society of Mechanical Engineers. A 巻 65, 号 632, p. 909-916, 発行日 1999 |
|||||
作成日 | ||||||
日付 | 1999-04-25 | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
ISSN | 0387-5008 | |||||
NII書誌ID(雑誌) | ||||||
収録物識別子タイプ | NCID | |||||
NC ID | AN0018742X | |||||
権利 | ||||||
権利情報 | 社団法人日本機械学会 | |||||
権利 | ||||||
権利情報 | 本文データは学協会の許諾に基づきCiNiiから複製したものである | |||||
出版タイプ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
NDC | ||||||
主題Scheme | NDC | |||||
主題 | 501 | |||||
公開者・出版者 | ||||||
出版者 | 社団法人日本機械学会 | |||||
関連(relation) |